Wafer fabrication expert witness candidates typically hold advanced degrees in electrical engineering, with specific expertise in semiconductor fabrication, semiconductor material, semiconductor equipment, and/or the semiconductor industry. A wafer fabrication expert witness must have a deep understanding not only of the manufacturing process, but also of the semiconductor device market, market share and the developing technologies of the industry’s leading players.
Basic information on technology and the semiconductor manufacturing equipment market is available through a market report from an industry analysis provider. But a wafer fabrication expert witness must have a deeper understanding of the history, the progression of the technology and often an understanding of which competitors were working on various designs at different points of time during the initial development stage.
While many competent consultants have the basic knowledge to get the job done, the expert witness carries the additional responsibility of providing testimony before the court, in a manner whereby lay people (the judge and every juror) can understand the technical nuances, such to make an informed decision.
An expert witness in this field will typically provide his or her expertise in intellectual property matters — a patent litigation in the federal court. It could be a patent infringement case in the District Court, an Inter Partes Review (IPR) in the PTAB (where the only expert testimony is through a deposition), or a patent case or proceeding in the International Trade Commission (ITC).
A testifying expert, or expert witness, is generally the only one in the court who is allowed to provide testimony as to his or her opinion — because it is an expert opinion. Regardless of whether this takes the form of testimony in a deposition or trial, or in an expert report, the engineering component will provide credibility to his or her analysis and allow the jury to consider the expert’s opinion with the weight it deserves. Cahn Litigation Services has completed numerous searches for an expert witness in the semiconductor and wafer fabrication space, providing candidates for each case to the specifications provided by the attorney in charge. Whether it’s for a semiconductor patent case, or for pre-litigation reverse engineering or failure analysis, Cahn Litigation Services has the experience required to turn the search around quickly and provide the right balance of expertise and testimony to get the job done.
Please Note: All Cahn Litigation expert witness searches are customized to attorneys' precise specifications and preferences. Attorneys are encouraged to discuss search parameters with a Cahn search specialist.
The below expert witness bios represent a small fraction of those Wafer Fabrication experts known by Cahn Litigation Services. These bios are provided to give attorneys a sense of the Wafer Fabrication landscape.
This expert has many years of experience in microcircuit and semiconductor technologies and has developed skills in areas of circuit design and analysis, device fabrication and assembly, testing, marketing, control system design and analysis, manufacturing operations and respective areas of quality, reliability, and defect / failure analysis.
This expert worked for a technology company in design, production, and QA, and was the QA manager of a DRAM Wafer Fabrication Facility.
This expert is an independent IP consultant and worked on-site with a company to develop and characterize their deep silicon plasma etch (DRIE) processes and equipment for use in advanced deep trench-isolated complementary bipolar SIMOX IC technology. Additionally, this expert worked with a large dicing equipment provider, signed a global distribution agreement for plasma dicing systems on wafer thinning/singulation for MEMS gyro wafers. This expert has deep experience as a patent litigation consultant and has been an expert witness providing both deposition and trial testimony.
This expert received bachelor's and master's degrees in Electrical and Electronic Engineering and a Ph.D. in Electrical Engineering and Computer Science. This expert's thesis advisor is widely regarded as one of the world's foremost experts in CMP. This expert participated in weekly group meetings and CMP project-specific meetings, in which CMP mechanics, materials and modeling projects were discussed and participants put forward interpretations of data, suggested experimental designs, and debated modeling approaches. This experience provided his initial grounding in and understanding of the field of CMP.
This expert's thesis work was on the topic of nanoimprint lithography (NIL), a semiconductor manufacturing process which has a number of physical commonalities with CMP. Both NIL and CMP involve mechanical contact between two solid bodies separated by a fluid layer (wafer/slurry/pad in CMP and wafer/resist/stamp in NIL), and in both processes, mechanical deformations of the solid bodies need to be understood and controlled to ensure that manufactured semiconductor devices are within dimensional specifications.
This expert has been working with one of the world's leading manufacturers of CMP equipment to model and simulate CMP using novel pad geometries. These pads are composed of multiple materials with heterogeneous properties.
This expert is an independent semiconductor manufacturing and processing consultant. This expert holds a Ph.D. in Materials Science from a prestigious university where the focus was, among other topics, the multi-purpose processing chamber for CVD, etch, and sputtering with measurement capability. This expert performed all wafer processing to construct MIS capacitors, including lithography, etch, CVD and PVD. As a consultant this expert reviewed new semiconductor technologies for etching and particle reduction in semiconductor processing chambers. This expert also suggested advanced semiconductor process equipment engineering for a military laboratory. This expert has strong experience as an expert witness, having served in five matters, and having given depositions and testified at trial on semiconductor manufacturing and semiconductor processing. This expert is well-published, and holds four utility patents.
This expert holds a PhD in Electrophysics. This expert began research in CMP and has served as PhD thesis advisor or co-advisor for PhD graduates in various areas on CMP, all working on full-wafer CMP tools using a conventional polishing table. This expert has co-authored two books, over 40 refereed journal articles and presented over 20 invited or contributed papers at international conferences on different aspects of the CMP process for a variety of applications. When there was increasing acceptance of CMP as a vital process in IC interconnect technology, this expert's programs were in the forefront of university research.
This expert worked with companies interested in becoming a CMP consumable supplier, mostly polishing pads and slurries. Working with such companies expanded this expert's knowledge base in these important consumables and enriched ongoing research programs. This expert's experience with industrial researchers on industrial-sponsored programs allowed this expert to better describe IC company needs during the decade of CMP expanding importance in IC manufacturing.
This expert has been a consultant and testifying expert in a variety of patents cases, mostly in the CMP area but also in other areas. One case involved using an aperture in a polishing pad to sense end-point detection during the CMP process. This expert has had appreciable experience in analyzing validity and infringement issues, being deposed and testifying at trial.
This expert is a noted independent semiconductor manufacturing and processing consultant. This expert has served as an expert in a number of plasma etching and semiconductor packaging matters. This expert holds a Ph.D. in Materials Science and worked developing semiconductor manufacturing technologies for four companies. This expert's work in the various positions led to three patents related to manufacturing processes and three patents related to circuits. This expert supervised the integration of the device and circuit technologies into one functioning semiconductor product. This expert has worked on 39 cases as a testifying expert or as a consulting expert and has testified at trials and in eighteen depositions, all of which were very successful. This expert also has approximately 20 IPRs under the belt, several of which, as mentioned above, are related to packaging diced wafers and plasma etching. This expert maintains a blog with more than 1,200 readers, an extensive educational semiconductor website, and a database frequently accessed by the USPTO, US Department of Justice, major technology companies, attorneys, and investors.