Semiconductor Packaging Expert Witnesses
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Semiconductor Packaging Expert Witness - Representative Bios
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The below expert witness bios represent a small fraction of those Semiconductor Packaging experts known by Cahn Litigation Services. These bios are provided to give lawyers a sense of the Semiconductor Packaging landscape.
Expert Witness #226732
This expert has many years' experience with semiconductor products having worked for several semiconductor companies. This expert authored a report on IC Packaging. This expert has deep expert witness experience.
Start Semiconductor Packaging Expert SearchExpert Witness #223130
This expert is a noted independent semiconductor manufacturing and processing consultant. This expert has served as an expert in a number of plasma etching and semiconductor packaging matters. This expert holds a Ph.D. in Materials Science and worked developing semiconductor manufacturing technologies for four companies. This expert's work in the various positions led to three patents related to manufacturing processes and three patents related to circuits. This expert supervised the integration of the device and circuit technologies into one functioning semiconductor product. This expert has worked on 39 cases as a testifying expert or as a consulting expert and has testified at trials and in eighteen depositions, all of which were very successful. This expert also has approximately 20 IPRs under the belt, several of which, as mentioned above, are related to packaging diced wafers and plasma etching. This expert maintains a blog with more than 1,200 readers, an extensive educational semiconductor website, and a database frequently accessed by the USPTO, US Department of Justice, major technology companies, attorneys, and investors.
Start Semiconductor Packaging Expert SearchExpert Witness #227291
This semiconductor packaging expert holds an MSEE and an Executive MBA and has over 35 years of experience in advanced package design, development, and production, including extensive hands-on work with multiple die, stacked die, Package-on-Package, and high-performance wire bond and flip-chip packages.
This expert led packaging innovation at semiconductor and communications technology companies, developing cost-optimized solutions for high-speed logic and communication products using BGA and flip-chip packages and pioneering IC-package-PCB co-design practices.
This expert has served as an expert witness in a number of ceramic IC packaging patent matters, contributing technical claim analysis and preparing for deposition testimony. This expert also spent over 5 years evaluating semiconductor packaging patent portfolios for IP monetization.
Start Semiconductor Packaging Expert SearchExpert Witness #255720
This semiconductor packaging expert holds a PhD and has direct, first-hand practical and manufacturing experience with semiconductor packaging technologies involving stacked memory with integrated controllers. At a technology company, this expert worked with a number of clients across several product spaces to help develop and physically assemble prototypes, including devices with stacked memory and integrated controllers.
Start Semiconductor Packaging Expert SearchExpert Witness #267465
This LCD expert holds a PhD and has advanced academic training in electrical engineering, optical and display technology, semiconductor technology, electronics technology, fabrication, design, and operation. This expert is well regarded in the fields of optoelectronics, photonics electronics, and semiconductors.
This expert has provided testimony in over 75 depositions relating to intellectual property and patents and has participated in over 20 trials, many involving display technologies. This expert has also addressed prior litigation involving LCD technology generally, LCD display layouts, optical and electronic fabrication designs, integrated circuits including drivers, electrical wiring and electrodes, and packaging.
This expert spent time during the 1990s at a major telecommunications and electronics company conducting research and development involving LCDs, OLEDs, lasers, LEDs, and general fabrication of display technology.
Start Semiconductor Packaging Expert SearchExpert Witness #284084
This chemical/electrochemical processing/semiconductor expert holds a Ph.D. in Chemistry and has worked in chemical and electrochemical processing of semiconductor devices, including inventing and improving chemical processes for integrated circuits and their packages, forming and leading an advanced analysis facility for integrated circuits using electron microscopy, mass spectrometry, and x-ray techniques, and leading a team developing next-generation integrated circuit packages.
This expert is a distinguished professor in a chemical and biomolecular engineering school, with research interests including chemical processes for the fabrication of integrated circuits and packages, and helped establish a prominent semiconductor research consortium's center of excellence focused on interconnects for integrated circuits.
This expert has taught elective courses on the chemistry of integrated circuit and electronic packaging fabrication for more than 30 years, with a focus on the role of chemical sciences in chip fabrication. This expert has published over 330 peer-reviewed journal publications and has been awarded over 65 United States Patents.
Start Semiconductor Packaging Expert SearchExpert Witness #298177
This semiconductor packaging expert has experience in the design, characterization, thermal enhancement, and thermomechanical reliability evaluation of many stacked package and stacked die package projects at a major semiconductor company. Related to Through Silicon Via (TSV) packaging, this expert served on a research and development team and evaluated TSV technologies for a wireless business unit. In that capacity, this expert analyzed trade-offs between TSV and side-by-side 2.5D interposer approaches, investigated TSV reliability issues, interfaced with a potential memory supplier partner, and directed university funding through a semiconductor research consortium to address fundamental TSV issues on an industry-wide basis.
Through this expert's career at a major semiconductor company, this expert developed multiple test structures with electrically addressable input-output circuits similar to identification circuits used in semiconductor packaging technology. This expert has written an extensive course on TSV and Fan-out Wafer Level Package technologies, describing the processes used to form TSVs and to stack TSV devices into packages, including processes behind forming High Bandwidth Memory (HBM) modules, interposers, and redistribution layers (RDLs). This material was condensed and incorporated into a broader class covering heterogeneous integrated packaging technologies, which has been presented multiple times to employees of major technology, semiconductor, and research organizations.
This expert is well familiar with redistribution layer processing, design, and high density interconnect (HDI) technologies, both fan-in and fan-out, as well as stacking processes, underfill techniques, and the electrical performance of TSVs relative to prior wire bond technologies. This expert has participated in a number of patent litigation actions, including a dispute before the U.S. International Trade Commission (ITC) that resolved out of court.
Start Semiconductor Packaging Expert SearchExpert Witness #298182
This semiconductor packaging expert holds a PhD and has over 30 years of packaging and manufacturing experience. This expert has experience in stacking 3D packaging and nano-packaging, and has worked on packaging for mixed-signal and RF packages.
This expert has worked on major processor architectures and commercial processor platforms, and has been involved with technical committees and board service for a prominent professional packaging society. This expert has testified on several occasions in packaging disputes.
Start Semiconductor Packaging Expert SearchExpert Witness #298191
This semiconductor packaging expert has worked in advanced semiconductor packaging for over 40 years, including flip chip, wafer-level packaging, stacked die, through-silicon vias, camera sensor packaging, and a variety of new wire-bonded packages.
This expert's early work in stacked memory die packages began at a major technology company and later included work with technology companies on stacked memory packages. For roughly a decade, this expert worked with several companies on process technology for creating TSVs (Through-Silicon Vias) and TGVs (Through-Glass Vias).
In recent years, this expert has served as an expert witness on stacked memory die matters.
Start Semiconductor Packaging Expert SearchExpert Witness #298852
This logic design expert holds a PhD and is an academic professor with substantial familiarity with memory technology. Although this expert's academic research has focused on compound semiconductor devices, particularly for wireless and wireline telecommunications, this expert has developed significant familiarity with the memory field through participation in multiple research consortium-funded centers and service as editor in chief of a prominent electron-devices journal, where memory technology is a major part of the publication's scope.
This expert has technical experience with error correction from work involving high-speed telecommunications systems and devices. This expert also has litigation experience, has testified before the U.S. International Trade Commission (ITC), has been deposed in connection with inter partes review proceedings and court cases, and has written expert reports addressing invalidity and non-infringement.
This expert has performed circuit simulations of SRAM alternatives to assess claimed performance benefits of asserted inventions and teaches courses in analog and digital circuit design involving memory and memory-related circuitry, including sense amplifiers and row and column selectors. This expert has also done work in high-performance packaging and signal-integrity fields.
Start Semiconductor Packaging Expert SearchExpert Witness #300969
This optoelectronics expert holds a PhD and is an academic professor at a well-regarded public university. This expert studied at a prestigious university under prominent researchers, including a Nobel Prize-winning researcher recognized for work involving the blue LED, with PhD research focused on growth, fabrication, characterization, and testing of deep UV LEDs. This expert also developed blue laser diodes.
This expert was a key member of a number of startup companies that developed and commercialized deep UV LEDs, visible LEDs, and various products utilizing both technologies. This expert also developed infrared detectors for a major aerospace company. This expert is well versed in semiconductor crystal growth, device design, device fabrication, characterization, and testing, and is also experienced with packaging and end product integration.
Start Semiconductor Packaging Expert Search