Please Note: All Cahn Litigation expert witness searches are customized to attorneys' precise specifications and preferences. Attorneys are encouraged to discuss search parameters with a Cahn search specialist.
The below expert witness bios represent a small fraction of those Semiconductor Packaging experts known by Cahn Litigation Services. These bios are provided to give attorneys a sense of the Semiconductor Packaging landscape.
This expert has many years' experience with semiconductor products having worked for several semiconductor companies. This expert authored a report on IC Packaging. This expert has deep expert witness experience.
This expert is a noted independent semiconductor manufacturing and processing consultant. This expert has served as an expert in a number of plasma etching and semiconductor packaging matters. This expert holds a Ph.D. in Materials Science and worked developing semiconductor manufacturing technologies for four companies. This expert's work in the various positions led to three patents related to manufacturing processes and three patents related to circuits. This expert supervised the integration of the device and circuit technologies into one functioning semiconductor product. This expert has worked on 39 cases as a testifying expert or as a consulting expert and has testified at trials and in eighteen depositions, all of which were very successful. This expert also has approximately 20 IPRs under the belt, several of which, as mentioned above, are related to packaging diced wafers and plasma etching. This expert maintains a blog with more than 1,200 readers, an extensive educational semiconductor website, and a database frequently accessed by the USPTO, US Department of Justice, major technology companies, attorneys, and investors.