This expert received bachelor's and master's degrees in Electrical and Electronic Engineering and a Ph.D. in Electrical Engineering and Computer Science. This expert's thesis advisor is widely regarded as one of the world's foremost experts in CMP. This expert participated in weekly group meetings and CMP project-specific meetings, in which CMP mechanics, materials and modeling projects were discussed and participants put forward interpretations of data, suggested experimental designs, and debated modeling approaches. This experience provided his initial grounding in and understanding of the field of CMP.
This expert's thesis work was on the topic of nanoimprint lithography (NIL), a semiconductor manufacturing process which has a number of physical commonalities with CMP. Both NIL and CMP involve mechanical contact between two solid bodies separated by a fluid layer (wafer/slurry/pad in CMP and wafer/resist/stamp in NIL), and in both processes, mechanical deformations of the solid bodies need to be understood and controlled to ensure that manufactured semiconductor devices are within dimensional specifications.
This expert has been working with one of the world's leading manufacturers of CMP equipment to model and simulate CMP using novel pad geometries. These pads are composed of multiple materials with heterogeneous properties.
Start Chemical Process Equipment Expert Search